【Technical Highlights】
Next-Gen DSP: Integrated 5nm/3nm DSP with advanced equalization to ensure signal integrity at 212.5Gbps per lane.
Superior Heat Dissipation: The OSFP form factor’s integrated finned heat sink allows for stable 24/7 operation in high-density AI server racks.
Silicon Photonics Ready: Available in advanced Silicon Photonics (Si Ph) integration for enhanced reliability and lower latency.
【Specifications Table】