PRIMUS IT Limited. TY_YOU_ARE PRIMUS IT Limited.
PRIMUS IT Limited.
PRIMUS IT Limited.

Optical Transceivers Mass Production Process


①Trimming the pin


Trimming the pin


  • When the optical device has not been trimmed, the pins are long and cannot be directly assembled (welded) on the PCBA, so this operation flow is required.


  • The length of the pin should be between 1/3L-1L on the PCBA welding board  (L is the length of the PCBA welding board)


Data Center : Optical Transceiver's QSFP+(40G)


②Shaping the pin


Shaping the pin


After the optical device is trimmed, the width between the pins is inconsistent with the thickness of the PCB welding board (1.0mm), in order to facilitate welding and assembly, the optical device pins need to be shaped;


③Welding + ④Welding inspection


Welding + ④Welding inspection

  • Welding TOSA/ROSA to the PCB board, and set the welding temperature of the electric welding iron at 360±10℃; when welding, pay attention to the polarity of TOSA and ROSA;

  • Use a magnifying glass to inspect the solder joints to prevent missing soldering or poor solder joint contact


L is the length of the PCBA welding board


⑤Assembling


Assembling


  • There are many types of accessories, such as shell, base, pull ring, unlocking button, pressing block, press buckle, etc., and bad assembly parts cannot be assembled during assembly.


⑥Debugging


Debugging


Module debugging


  • Debugging extinction ratio

  • Eye diagram

  • Receiving sensitivity

  • Optical power

  • Calibration DDM etc...


The equipment involved is


  • Computer

  • Eye diagram device

  • Optical power meter

  • Attenuator

  • Stabilized power supply

  • One-to-two splitter

  • Fiber patch cord


⑨Cleaning the end face


Cleaning the end face


  • The cleanliness of the end face is critical to the performance of the optical module

  • If the end face cannot be guaranteed to be clean and free of scratches, it will be defective 


 ⑩Locking the shell+Putting the dust-proof cap+Cleaning the modules


Locking the shell+Putting the dust-proof cap+Cleaning the modules


Locking the shell+Putting the dust-proof cap+Cleaning the modules